Bluetooth 3.5 mm

Nikon Z50 bezspoguļa kamera 20.9 MP DX formāta CMOS sensors EXPEED 6 attēla procesors UHD 4K un Full HD video ierakstīšana 2.36m-Dot OLED elektroniskais skatu meklētājs 3.2" 1.04m-Dot 180° slīpēšanas skārienjūtīgais ekrāns ISO 100-51200, uzņemšana līdz 11 kadriem sekundē 209-punktu hibrīda AF, Acu noteikšana Iebūvēts Wi-Fi un Bluetooth Nikon NIKKOR Z DX 16-50mm f/3.5-6.3 VR objektīvs Z-Mount objektīvs/DX formāts 24-75 mm (35 mm ekvivalents) aperture Diapazons: f/3.5 līdz f/16 Viens papildus-zemas dispersijas elements četri asfēriskie elementi Superintegrēts pārklājums Stepēšanas motors AF sistēma Vibrāciju samazināšanas attēla stabilizācija Programmējams vadības gredzens Rounded 7-lāpstiņu diafragma

GEEKOM A9MAX AMD AI 9 HX 370 32GB 1TB + Win 11 Pro Mini PCThe GEEKOM A9 MAX, configured with AMD Ryzen™ AI 9 HX 370 + 32 GB DDR5 + 1 TB SSD, is a mini PC dedicated to users who utilize artificial intelligence in their work and professional projects. It combines AI computing performance of up to 80 TOPS, gaming-class Radeon™ 890M graphics, and extensive ports in a compact chassis. It comes with Windows 11 Pro and also supports Linux, such as Ubuntu or Manjaro, as well as Android x86. It is ideal for working with Visual Studio, Docker, AI model training environments, etc. Additionally, it offers compatibility with the Microsoft Copilot+ ecosystem, the AMD Ryzen AI platform development strategy, and open tools for implementing local models.A new level of AI performanceAt the heart of the device is the AMD Ryzen™ AI 9 HX 370 processor based on the "Strix Point" architecture. Equipped with a dedicated XDNA 2 AI engine, it offers up to 50 TOPS of NPU power and a total AI acceleration of 77-80 TOPS. This enables Copilot+ support, local execution of large language models, and advanced content generation. Stable Diffusion, Topaz AI, local LLMs via LM Studio or Ollama — everything runs smoothly and stably while maintaining effective temperature control.Radeon™ 890M — gaming without compromiseThe integrated AMD Radeon™ 890M graphics with 16 RDNA 3.5-based CUs offers high performance. It allows for comfortable gameplay in 1080p and even 2K in titles such as Valorant, Fortnite, League of Legends, and CS2. Support for FidelityFX Super Resolution (FSR) technology improves smoothness and image quality in compatible games. The chip also performs well in 4K playback and light 3D rendering, making it ideal for creators and gamers.IceBlast 2.0 coolingStability is ensured by the improved IceBlast 2.0 cooling system, which includes a large copper heat sink, dual heat pipes, a powerful low-noise fan, and high-quality thermal materials. The side air intake and rear air exhaust design effectively prevents overheating. Even during prolonged loads or long gaming sessions, the A9 Max remains stable.Expanded memory and storageThe model supports up to 128 GB of DDR5-5600 MHz memory in dual-channel mode and two PCIe x4 NVMe drives (M.2 2280 + M.2 2230). It provides an excellent foundation for advanced multitasking, working with AI models, or 4K video editing.Built-in ports and next-generation connectivityThe A9 Max offers two USB4 ports (40 Gbps, Power Delivery, DP Alt Mode), five USB-A 3.2 Gen 2 ports, one USB-A 2.0 port, two HDMI 2.1 FRL outputs, dual 2.5GbE LAN, a full-size SD 4.0 card reader, as well as Wi-Fi 7 and Bluetooth 5.4. Supports 4K and 8K displays – whether you're a creator who needs multiple screens or an advanced user managing servers and NAS devices, the A9 Max keeps you connected.Compact chassisDespite its dimensions of only 135 × 132 × 45.6 mm, the A9 Max houses a 54W TDP processor with up to 12 high-performance cores and the latest interfaces. The robust metal construction supports heat dissipation and offers VESA mounting options.Security and durabilityThe device is equipped with a Kensington Lock, TPM 2.0 support, and dual 2.5G LAN for secure wired networks. The design has undergone rigorous reliability, thermal control, and mechanical endurance testing, ensuring a long service life even in demanding environments. Manufacturer GEEKOM Model A9 MAX Processor AMD Ryzen™ AI 9 HX 370 (Strix Point architecture) Processor TDP 54 W CPU cores up to 12 cores AI engine (NPU) AMD XDNA™ 2 AI performance (NPU) up to 50 TOPS Total AI acceleration 77–80 TOPS Graphics AMD Radeon™ 890M (integrated, RDNA 3.5) GPU compute units 16 CU RAM (installed) 32 GB DDR5 Maximum supported memory Up to 128 GB DDR5-5600 MHz (dual-channel SO-DIMM) Drive (installed) 1 TB PCIe NVMe SSD Drive support 2 × PCIe x4 NVMe (1 × M.2 2280 + 1 × M.2 2230) Ports 2 × USB4 (40 Gb/s, Power Delivery, DisplayPort Alt Mode)5 × USB-A 3.2 Gen 21 × USB-A 2.02 × HDMI 2.1 FRL2 × LAN 2.5GbE Wi

(APS-C) CMOS attēla sensors Kopējais pikseļu skaits 25,5 MP Dabiski atbalsta RF un RF-S objektīvus Dual Pixel CMOS AF II fokusēšana Automātiskis 100–32 000 ISO (ar 1/3 vai pilnu palielinājuma soli). ISO var paplašināt līdz H: 51200 0,39 collu OLED krāsu elektroniskais skatu meklētājs 7,5 cm (2,95 collas) TFT krāsu LCD monitors; aptuveni 1,04 miljoni punktu 4K30 video, 4K60 ar apgriešanu; HDR-PQ 23 kadri/s E. Aizvars, 15 kadri/s Meh. Aizvars Vertikālais režīms Daudzfunkciju pēdas, Wi-Fi un Bluetooth RF-S 18-150mm f/3.5-6.3 IS STM objektīvs

(APS-C) CMOS attēla sensors Kopējais pikseļu skaits 25,5 MP Dabiski atbalsta RF un RF-S objektīvus Dual Pixel CMOS AF II fokusēšana Automātiskis 100–32 000 ISO (ar 1/3 vai pilnu palielinājuma soli). ISO var paplašināt līdz H: 51200 0,39 collu OLED krāsu elektroniskais skatu meklētājs 7,5 cm (2,95 collas) TFT krāsu LCD monitors; aptuveni 1,04 miljoni punktu 4K30 video, 4K60 ar apgriešanu; HDR-PQ 23 kadri/s E. Aizvars, 15 kadri/s Meh. Aizvars Vertikālais režīms Daudzfunkciju pēdas, Wi-Fi un Bluetooth RF-S 18-150mm f/3.5-6.3 IS STM objektīvs

32,5 MP APS-C CMOS sensors Dual Pixel CMOS AF II 4K60 10 bitu video, HDR-PQ & C-Log 3 30 kadru/s E. aizvara, 15 kadru/s Mech. Shutter 2,36 m-dot OLED elektroniskais meklētājs 1,6 m punkta mainīga leņķa skārienjūtīgais LCD ekrāns Sensora nobīdes 5 asu attēla stabilizācija Divi UHS-II atmiņas karšu slots Daudzfunkcionāla botiņa, Wi-Fi un Bluetooth RF-S 18-150 mm f/3,5-6,3 IS STM objektīvs

40,2 MP APS-C X-Trans CMOS 5 HR sensors X-Processor 5 attēla procesors Fujinon 23 mm f/2 objektīvs 35 mm pilna kadra ekvivalents Attēla stabilizācija ķermenī ar 6 stabilizācijas pakāpēm 425 punktu inteliģentā hibrīdā AF sistēma Hibrīda 0,66x OVF ar 3,69 mm punktu OLED EVF 3,0" 1,62 m punkta slīpais skārienekrāns ar noliektu ekrānu Bluetooth un Wi-Fi savienojamība 20 filmu simulācijas režīmi ar REALA ACE

40,2 MP APS-C X-Trans CMOS 5 HR sensors X-Processor 5 attēla procesors Fujinon 23 mm f/2 objektīvs 35 mm pilna kadra ekvivalents Attēla stabilizācija ķermenī ar 6 stabilizācijas pakāpēm 425 punktu inteliģentā hibrīdā AF sistēma Hibrīda 0,66x OVF ar 3,69 mm punktu OLED EVF 3,0" 1,62 m punkta slīpais skārienekrāns ar noliektu ekrānu Bluetooth un Wi-Fi savienojamība 20 filmu simulācijas režīmi ar REALA ACE